Micron Laser Technology gives PCB Depanelizer and part excising solutions for consumer products, original equipment manufacturers, and pcb manufacturers. MLT’s numerous laser machining centers are equipped to take care of volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a combination of both.
Depending on the material as well as the part requirements, MLT offers a tool-less part removal process in the form of final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the main benefit of speed, positional accuracy, no tooling cost or wear, no part induced stresses, with no cutting oils or other contaminants.
Hold-in tabs are small uncut sections about the part employed to secure the part in the panel. The hold-in tabs can be used for easy of handling small parts or part securement for further processing. The hold-in tab width is chosen based on the amount of force desired to removed the part from your panel/sheet or known forces to become applied by downstream processes like component loading or electro-polish. MLT can produce tabs generally in most any material and also to any width and location regarding the part.
Laser scoring produces a limited depth ablation line inside the part or material set. The depth is generally 50% from the material thickness but could be controlled to your desired depth. The scoring acts similar to the hold-tab to secure the part within the panel or sheet, but provides for individual parts to become ‘snapped’ out. Laser scoring lines may also be used as being a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into shape without expensive forming dies.
Comparable to scoring or v-grooves, laser perforations are another option for tool-less part removal from a panel or sheet. Perforations could be laser formed to any size and spacing to meet the required removal and Motorized PCB Depanelizer. Depending on the material and the part requirements, BEST laser services supplies a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. Utilizing a laser to perform the depaneling affords the user the benefit of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost and no cutting oils or any other contaminants.
Laser depaneling is great for rigid-flex boards as it provides a precise way to cut through a variety of materials including although not restricted to the following most common materials seen:
Combinations thereof, suitable for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST may be that provider of laser depanelization if you have lots of IoT devices which lmuteg to get precisely machined or reduce to fit perfectly directly into small mechanical enclosures.
As a result of contact-free processing that continues with laser depanelization of printed circuit boards, there is very little distortion even when thin materials are used. When boards are milled or punched out using a mechanical tool there could end up being a loss precision and potentially a distortion inside the outside board dimensions. Even worse it may crack solder joints when using these mechanical means. In BEST laser depanelization system feature fiducial registration and internet based scaling, which means already existing distortions could be compensated and also the cut contours positioned precisely inside the layout.
The ways for straight line PCB Laser Depaneling, which can be setup for rectangular-shaped PCBs, all cut or crush the advantage of the board edge. These techniques include die cutting, punching or V-scoring the assembly or using a wheel cutter or even a saw. The sawing method typically uses a single rotating blade spinning at high RPM to reduce the panel to the shapes required. This technique produces heat inside the eliminate area as
well as creating debris being a byproduct from the cutting operation. In V-scoring the depth from the thickness from the board is 30-40% from the original board thickness since it is cut from each side in the board. After assembly the board is broken at this particular v-score line. Alternately a “pizza cutter” cuts through the V-score of the panel and cuts the rest of the web till the boards are in their final cutout shape thereby putting strain on the components and solder joints-especially those nearby the board edge. In another method, the singulated board outline may be punched out form the panel. This calls for that the new punch be applied for every type of circuit board meaning it is far from a flexible approach to board eliminate. The punch force can also bend or deform the sides of the PCB.